Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-02-14
2006-02-14
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S735000
Reexamination Certificate
active
06998703
ABSTRACT:
An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit layer and may be made from stressed metal or physical bending of a metal structure. The spring contacts enable electrical coupling to adjacent circuit layers immediately above or immediately below the integrated circuit layer.
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Joseph Fjelstad, Neo-Manhattan Technology—A novel HDI Manufacturing Process (IPC Flex and Chips Symposium, Tempe, AZ Feb. 11-12, 2003.
Chen Kent
Palo Alto Research Center Inc.
Potter Roy
LandOfFree
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