Semiconductor device and method for producing the same

Details Semiconductor device and method for producing the same Semiconductor device and method for producing the same

2006-06-06

2006-06-06

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S690000

Reexamination Certificate

active

07057283

ABSTRACT:
A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide α-ray shielding of the semiconductor device.

REFERENCES:
patent: 4983023 (1991-01-01), Nakagawa et al.
patent: 5442482 (1995-08-01), Johnson et al.
patent: 5887520 (1999-03-01), Kinoshita
patent: 6037662 (2000-03-01), Yoon et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6313532 (2001-11-01), Shimoishizaka et al.
patent: 6472249 (2002-10-01), Kuwabara
patent: 6472724 (2002-10-01), Matsuzawa et al.
patent: 2002/0024124 (2002-02-01), Hashimoto
patent: 2002/0076651 (2002-06-01), Hurditch et al.
patent: 05-175260 (1993-07-01), None
patent: 7-202382 (1995-08-01), None
patent: 8-274243 (1996-10-01), None
patent: 9-199635 (1997-07-01), None
patent: 9-219421 (1997-08-01), None
patent: 9-321084 (1997-12-01), None
patent: 10-242333 (1998-09-01), None
patent: 10-092865 (1998-10-01), None
patent: 11-054649 (1999-02-01), None
patent: A-11-111768 (1999-04-01), None
patent: 11-147950 (1999-06-01), None
patent: 11-191571 (1999-07-01), None
patent: 11-191572 (1999-07-01), None
patent: 11-204678 (1999-07-01), None
patent: 11-274155 (1999-10-01), None
patent: 11-274365 (1999-10-01), None
patent: 11-354560 (1999-12-01), None
patent: 2000-164761 (2000-06-01), None
patent: 11-299058 (2001-04-01), None
patent: 2001-118956 (2001-04-01), None
patent: WO 96/09645 (1996-03-01), None
patent: WO 98/025298 (1998-11-01), None
patent: WO 99/23696 (1999-05-01), None
patent: WO 00/52755 (2000-08-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and method for producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3705090