Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-11-21
2006-11-21
Kim, Paul D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S603030, C029S603070, C029S603150, C029S860000, C205S119000, C205S122000, C360S235700, C360S235800, C360S236300, C360S236500, C360S237000, C427S127000, C427S128000
Reexamination Certificate
active
07137189
ABSTRACT:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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Ahmad, S.S.; “Impact of residue on AI/Si pads on gold bonding”; Electronics Components Conference, 1988; Proceedings of the 38th, May 9-11, 1988; pp. 534-538.
Cher Ming Tan, Er, E. & Younan Hua, Chai, V.; “Failure analysis of bond pad metal peeling using FIB and AFM”; IEEE Transactions on vol. 21 Issue: 4, Dec. 1998; pp. 585-591.
Fujii Naoki
Matsumoto Yuhsuke
Mita Yasuhiro
Murokawa Takaaki
Satoh Takuya
Bracewell & Giuliani LLP
Kim Paul D.
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