Multiple die stack apparatus employing T-shaped interposer...

Details Multiple die stack apparatus employing T-shaped interposer... Multiple die stack apparatus employing T-shaped interposer...

2006-06-20

2006-06-20

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000

Reexamination Certificate

active

07064006

ABSTRACT:
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.

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