Semiconductor components having multiple on board capacitors

Details Semiconductor components having multiple on board capacitors Semiconductor components having multiple on board capacitors

2006-02-21

2006-02-21

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S532000

Reexamination Certificate

active

07002248

ABSTRACT:
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the die. The capacitor includes a first electrode in electrical communication with a first terminal contact for the component, and a second electrode in electrical communication with a second terminal contact for the component. The electrodes are separated by a dielectric layer and protected by an outer protective layer of the component. The capacitor can be fabricated using redistribution layers on a wafer containing multiple dice. The component can be used to construct systems such as multi chip packages and multi chip modules.

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