Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-08-01
2006-08-01
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S685000, C257S686000, C257S723000, C257S778000, C257SE23172, C257SE23173, C257SE23174, C257SE23175, C257SE21503
Reexamination Certificate
active
07084513
ABSTRACT:
A semiconductor device includes a first semiconductor chip (5) having a first terminal (7) on one surface, a second semiconductor chip (1a) which is larger than the first semiconductor chip (5) and on which the first semiconductor chip (5) is stacked and which has a second terminal (3) on one surface, an insulating layer (10) formed on a second semiconductor chip (1a) to cover the first semiconductor chip (5), a plurality of holes (10a) formed in the insulating layer (10) on at least a peripheral area of the first semiconductor chip (5), a via (11a) formed like a film on inner peripheral surfaces and bottom surfaces of the holes (10a) and connected electrically to the second terminal (3) of the second semiconductor chip (1a), a wiring pattern (11b) formed on an upper surface of the insulating layer (10), and an external terminal (14) formed on the wiring pattern (11b).
REFERENCES:
patent: 5903049 (1999-05-01), Mori
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6181002 (2001-01-01), Juso et al.
patent: 6344682 (2002-02-01), Tomita
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6476500 (2002-11-01), Kimura
patent: 6548911 (2003-04-01), Yu et al.
patent: 6563205 (2003-05-01), Fogal et al.
patent: 6700178 (2004-03-01), Chen et al.
patent: 6759737 (2004-07-01), Seo et al.
patent: 6765299 (2004-07-01), Takahashi et al.
patent: 6849945 (2005-02-01), Horiuchi et al.
patent: 0 706 208 (1996-04-01), None
patent: 2001-250836 (2001-09-01), None
patent: 2002-50721 (2002-02-01), None
patent: 2001-0063892 (2001-07-01), None
Office Action from the Korean Patent Office dated Jan. 27, 2006 in corresponding Korean Patent Application No. 10-2004-7008710.
Aiba Yoshitaka
Matsuki Hirohisa
Okamato Tadahiro
Sato Mitsutaka
Smith Zandra V.
Soward Ida M.
Westerman, Hattori, Daniels & Adrian , LLP.
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