Electrically isolated and thermally conductive double-sided...

Details Electrically isolated and thermally conductive double-sided... Electrically isolated and thermally conductive double-sided...

2006-08-22

2006-08-22

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE21499, C257SE23181, C257SE23044, C257S692000, C257S728000, C257S732000, C257S782000

Reexamination Certificate

active

07095098

ABSTRACT:
An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.

REFERENCES:
patent: 4538170 (1985-08-01), Yerman
patent: 4902854 (1990-02-01), Kaufman
patent: 5767570 (1998-06-01), Rostoker
patent: 6020636 (2000-02-01), Adishian
patent: 6462413 (2002-10-01), Polese et al.
patent: 6542365 (2003-04-01), Inoue
patent: 6614659 (2003-09-01), Feigenbaum et al.
patent: 6670216 (2003-12-01), Strauch
patent: 6812553 (2004-11-01), Gerbsch et al.
patent: 2001/0033477 (2001-10-01), Inoue et al.
patent: 2002/0163070 (2002-11-01), Choi

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