Structure and method of making capped chips including...

Details Structure and method of making capped chips including... Structure and method of making capped chips including...

2006-10-31

2006-10-31

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23129

Reexamination Certificate

active

07129576

ABSTRACT:
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.

REFERENCES:
patent: 4825284 (1989-04-01), Soga et al.
patent: 4984358 (1991-01-01), Nelson
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5578874 (1996-11-01), Kurogi et al.
patent: 5610431 (1997-03-01), Martin
patent: 5705858 (1998-01-01), Tsukamoto
patent: 5872697 (1999-02-01), Christensen et al.
patent: 5952712 (1999-09-01), Ikuina et al.
patent: 5965933 (1999-10-01), Young et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6140144 (2000-10-01), Najafi et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6261945 (2001-07-01), Nye, III et al.
patent: 6279227 (2001-08-01), Khandros et al.
patent: 6326697 (2001-12-01), Farnworth
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6373130 (2002-04-01), Salaville
patent: 6376279 (2002-04-01), Kwon et al.
patent: 6396470 (2002-05-01), Zhang et al.
patent: 6420208 (2002-07-01), Pozder et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 6498381 (2002-12-01), Halahan et al.
patent: 6583444 (2003-06-01), Fjelstad
patent: 6596634 (2003-07-01), Umetsu et al.
patent: 6627864 (2003-09-01), Glenn et al.
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 6627998 (2003-09-01), Caletka et al.
patent: 6646289 (2003-11-01), Badehi
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6693361 (2004-02-01), Siniaguine et al.
patent: 6699730 (2004-03-01), Kim et al.
patent: 6717254 (2004-04-01), Siniaguine
patent: 6753205 (2004-06-01), Halahan
patent: 6787916 (2004-09-01), Halahan
patent: 6849916 (2005-02-01), Glenn et al.
patent: 2002/0089835 (2002-07-01), Simmons
patent: 2002/0090803 (2002-07-01), Salaville
patent: 2002/0102004 (2002-08-01), Minervini
patent: 2003/0025204 (2003-02-01), Sakai
patent: 2003/0052404 (2003-03-01), Thomas
patent: 2003/0067073 (2003-04-01), Akram et al.
patent: 2003/0133588 (2003-07-01), Pedersen
patent: 2003/0151139 (2003-08-01), Kimura
patent: 2003/0159276 (2003-08-01), Wakefield
patent: 2003/0168725 (2003-09-01), Warner et al.
patent: 2004/0007774 (2004-01-01), Crane, Jr. et al.
patent: 2004/0099938 (2004-05-01), Kang et al.
patent: 2004/0104261 (2004-06-01), Sterrett et al.
patent: 2004/0104470 (2004-06-01), Bang et al.
patent: 2004/0115866 (2004-06-01), Bang et al.
patent: 2004/0145054 (2004-07-01), Bang et al.
patent: 2004/0238931 (2004-12-01), Haba et al.
patent: 2004/0238934 (2004-12-01), Warner et al.
patent: 2005/0017348 (2005-01-01), Haba et al.
patent: 2005/0067681 (2005-03-01), DeVilleneuve et al.
patent: 2005/0067688 (2005-03-01), Humpston
patent: 2005/0082653 (2005-04-01), McWilliams et al.
patent: 2005/0082654 (2005-04-01), Humpston et al.
patent: 2005/0085016 (2005-04-01), McWilliams et al.
patent: 2005/0087861 (2005-04-01), Burtzlaff et al.
patent: 2005/0095835 (2005-05-01), Humpston et al.
patent: 2005/0116344 (2005-06-01), Humpston
patent: 1 071 126 (2001-01-01), None
patent: 08-213874 (1996-08-01), None
patent: WO-02/058233 (2002-07-01), None
patent: WO-04/017399 (2004-02-01), None
patent: WO-04/023546 (2004-03-01), None
patent: WO-04/025699 (2004-03-01), None
U.S. Appl. No. 10/077,388, filed Feb. 15, 2002, assigned to Tessera, Inc.

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