Method and apparatus for polishing a workpiece surface

Details Method and apparatus for polishing a workpiece surface Method and apparatus for polishing a workpiece surface

2006-10-17

2006-10-17

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000, C451S007000, C451S008000, C451S009000, C451S010000, C451S041000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

07121922

ABSTRACT:
The invention relates to a method for machining a workpiece surface, wherein an area to be machined of the workpiece surface is machined under the influence of a polishing operation and wherein, during the machining, the displacement of the area to be machined relative to a reference area rigidly coupled to the workpiece surface is monitored by means of interferometry. The invention further relates to a machining apparatus, comprising a polishing tool and a measuring tool, while the measuring tool comprises an interferometer. Preferably, the polishing tool comprises a fluid jet polishing device.

REFERENCES:
patent: 4594003 (1986-06-01), Sommargren
patent: 5067282 (1991-11-01), Netzel
patent: 5822066 (1998-10-01), Jeong et al.
patent: 6032377 (2000-03-01), Ichikawa et al.
patent: 6301009 (2001-10-01), Tinker
patent: 198 55 455 (1999-06-01), None

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