Printed circuit board

Details Printed circuit board Printed circuit board

2006-12-12

2006-12-12

Enad, Elvin (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S792000, C361S794000, C174S260000, C174S264000

Reexamination Certificate

active

07149092

ABSTRACT:
In a printed circuit board of the invention, a first signal wiring layer, a first ground layer, a second ground layer and a second signal wiring layer are laminated via an insulating material. A first signal wiring is formed on the first signal wiring layer and a second signal wiring is formed on the second signal wiring layer. The two signal wirings are connected via a first through hole. The conductive first ground layer and the conductive second ground layer are connected via a second through hole. The second through hole is insulated from the first through hole and formed so as to surround the first through hole.

REFERENCES:
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5442143 (1995-08-01), Schmidt et al.
patent: 5565262 (1996-10-01), Azzaro et al.
patent: 5876842 (1999-03-01), Duffy et al.
patent: 6617526 (2003-09-01), Miller
patent: 6937120 (2005-08-01), Fisher et al.

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