Method for measuring registration of overlapping material...

Details Method for measuring registration of overlapping material... Method for measuring registration of overlapping material...

2006-08-22

2006-08-22

Werner, Brian (Department: 2621)

Image analysis

Applications

Manufacturing or product inspection

C348S086000, C435S007800

Reexamination Certificate

active

07095885

ABSTRACT:
A method and apparatus for measuring registration between two or more integrated circuit layers is disclosed. Images of actual operative circuitry of different layers of a semiconductor wafer, obtained by an optical technique or a scanning electron microscope, are digitized and analyzed for the relative placement of pattern shapes of the corresponding layers. This relative placement is then compared to tolerance values and if out of tolerance misregistration of the two layers is indicated.

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