Flame retardant epoxy resin composition, semiconductor...

Details Flame retardant epoxy resin composition, semiconductor... Flame retardant epoxy resin composition, semiconductor...

2006-08-15

2006-08-15

Gulakowski, Randy (Department: 1712)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C257S793000, C257S796000, C523S400000, C523S461000, C525S396000, C525S523000

Reexamination Certificate

active

07090895

ABSTRACT:
An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.

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patent: 2003/0001140 (2003-01-01), Starkey
patent: 63-273652 (1988-11-01), None

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