Method for die removal from plastic packages

Details Method for die removal from plastic packages Method for die removal from plastic packages

2006-06-27

2006-06-27

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Repair or restoration

Reexamination Certificate

active

07067332

ABSTRACT:
A method for removing a die from a plastic package. The first step of the method is to remove the package's cap. Next, the package and the die within it are placed on a hot plate and heated up. When the plastic package's temperature reaches a certain limit, the plastic package cracks, resulting in at least one fracture in the package. Each side of the cracked plastic package along the fracture is then grasped by a pair of pliers and the two pairs of pliers are pulled in opposite directions. As a result, the die is detached from the plastic package.

REFERENCES:
patent: 5424254 (1995-06-01), Damiot
patent: 6223893 (2001-05-01), Kitamura et al.
patent: 6309899 (2001-10-01), Mahanpour et al.
patent: 6335208 (2002-01-01), Lowry
patent: 6429028 (2002-08-01), Young et al.
patent: 6981585 (2006-01-01), Kitamura et al.

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