Photosensitive resin composition and photosensitive films...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C522S064000, C522S141000, C522S142000, C524S708000, C524S731000, C524S792000, C528S026000, C528S322000, C428S473500, C430S281100

Reexamination Certificate

active

07141614

ABSTRACT:
A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 3979342 (1976-09-01), Baidins et al.
patent: 4040831 (1977-08-01), Rubner et al.
patent: 4278752 (1981-07-01), Gervay et al.
patent: 4499149 (1985-02-01), Berger
patent: 4586997 (1986-05-01), Lee
patent: 4829131 (1989-05-01), Lee
patent: 5045435 (1991-09-01), Adams et al.
patent: 5098814 (1992-03-01), Tunney et al.
patent: 5385808 (1995-01-01), Tokoh et al.
patent: 5589319 (1996-12-01), Katou et al.
patent: 5914354 (1999-06-01), Kato
patent: 6096480 (2000-08-01), Ishikawa et al.
patent: 6096850 (2000-08-01), Chiang et al.
patent: 6319656 (2001-11-01), Kikkawa et al.
patent: 6605353 (2003-08-01), Okada et al.
patent: 6743841 (2004-06-01), Shimizu et al.
patent: 2004/0235992 (2004-11-01), Okada et al.
patent: 0 214 103 (1987-03-01), None
patent: 0 317 941 (1989-05-01), None
patent: 0 361 409 (1990-04-01), None
patent: 0 488 339 (1992-06-01), None
patent: 0 493 317 (1992-07-01), None
patent: 0 546 768 (1993-06-01), None
patent: 0 666 504 (1995-08-01), None
patent: 0 676 669 (1995-10-01), None
patent: 0 822 448 (1998-02-01), None
patent: 0 860 742 (1998-08-01), None
patent: 0 863 436 (1998-09-01), None
patent: 0 953 590 (1999-11-01), None
patent: 2 369 590 (1978-05-01), None
patent: 49-115541 (1974-11-01), None
patent: 51-040922 (1976-04-01), None
patent: 54-145794 (1979-11-01), None
patent: 59-160140 (1984-09-01), None
patent: 63-027826 (1988-02-01), None
patent: 63-027834 (1988-02-01), None
patent: 02-000870 (1990-01-01), None
patent: 03-168214 (1991-07-01), None
patent: 03-170547 (1991-07-01), None
patent: 03-186847 (1991-08-01), None
patent: 04-110348 (1992-04-01), None
patent: 04-120543 (1992-04-01), None
patent: 04-284455 (1992-10-01), None
patent: 05-247211 (1993-09-01), None
patent: 06-011830 (1994-01-01), None
patent: 08-253677 (1996-01-01), None
patent: 09-100350 (1997-04-01), None
patent: 10-265571 (1998-10-01), None
patent: 11-052572 (1999-02-01), None
patent: 2001-075270 (2001-03-01), None
patent: 2001-332859 (2001-11-01), None
patent: 2001-335619 (2001-12-01), None
patent: 2002-003516 (2002-01-01), None
patent: 2002-006490 (2002-01-01), None
patent: 2002-179742 (2002-06-01), None
patent: 2002-351073 (2002-12-01), None
patent: 2002-351074 (2002-12-01), None
patent: 9 317 368 (1993-09-01), None
patent: WO 01/40873 (2001-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photosensitive resin composition and photosensitive films... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition and photosensitive films..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition and photosensitive films... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3690101

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.