Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-02-07
2006-02-07
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S666000, C029S829000, C029S830000, C029S874000, C257S701000, C257S724000, C257S784000, C257S786000
Reexamination Certificate
active
06995043
ABSTRACT:
A routing element for use with a multichip module that includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
REFERENCES:
patent: 4709468 (1987-12-01), Wilson
patent: 4890157 (1989-12-01), Wilson
patent: 5245216 (1993-09-01), Sako
patent: 5362984 (1994-11-01), Konda et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6137164 (2000-10-01), Yew et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6284982 (2001-09-01), Kusner et al.
patent: 6333549 (2001-12-01), Drehobl et al.
patent: 6376279 (2002-04-01), Kwon et al.
patent: 6444921 (2002-09-01), Wang et al.
patent: 6462976 (2002-10-01), Olejniczak et al.
patent: 6492201 (2002-12-01), Haba
patent: 6521994 (2003-02-01), Huse et al.
patent: 6521995 (2003-02-01), Akram et al.
patent: 6555921 (2003-04-01), Kwon et al.
patent: 6822320 (2004-11-01), Haba
patent: 2002/0039464 (2002-04-01), Yoshimura et al.
patent: 2002/0050633 (2002-05-01), Matsumoto
patent: 2002/0171144 (2002-11-01), Zhang et al.
patent: 2004/0164396 (2004-08-01), Hashimoto
Brooks Jerry M.
Corisis David J.
Reynolds Tracy V.
Schwab Matt E.
Chambliss Alonzo
Micro)n Technology, Inc.
TraskBritt
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