Dynamic magnetic information storage or retrieval – Head – Core
Reexamination Certificate
2006-06-20
2006-06-20
Chen, Tianjie (Department: 2656)
Dynamic magnetic information storage or retrieval
Head
Core
Reexamination Certificate
active
07064924
ABSTRACT:
Single write poles tend to large shape anisotropy which results in a very large remnant field when not actually writing. This has now been eliminated by giving the write pole the form of a three layer laminate in which two ferromagnetic layers are separated by a non-magnetic or antiferromagnetic coupling layer. Strong magnetostatic coupling between the outer layers causes their magnetization directions to automatically be antiparallel to one another, unless overcome by the more powerful write field, leaving the structure with a low net magnetic moment. The thickness of the middle layer must be carefully controlled.
REFERENCES:
patent: 5108837 (1992-04-01), Mallary
patent: 5621592 (1997-04-01), Gill et al.
patent: 6255040 (2001-07-01), Sasaki
patent: 6278590 (2001-08-01), Gill et al.
patent: 6477007 (2002-11-01), Shukh et al.
patent: 2003/0076629 (2003-04-01), Minor
patent: 2003/0133224 (2003-07-01), Minor et al.
patent: 2003/0197976 (2003-10-01), Van der Heijden et al.
patent: 2004/0004786 (2004-01-01), Shukh et al.
patent: 2004/0066574 (2004-04-01), Crue et al.
patent: 2004/0201918 (2004-10-01), Guan et al.
patent: 2004/0252415 (2004-12-01), Shukh et al.
TABLE 2.3, Kanu G. Ashar, “Magnetic Disk Drive Technology,” IEEE Press, 1996p. 29.
Chang Jeiwei
Guan Lijie
Hu Ben
Ju Kochan
Li Min
Ackerman Stephen B.
Chen Tianjie
Headway Technologies Inc.
Saile Ackerman LLC
LandOfFree
Thin laminated single pole perpendicular write head does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin laminated single pole perpendicular write head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin laminated single pole perpendicular write head will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3688604