Plating

Details Plating Plating

2006-08-15

2006-08-15

Phasge, Arun S. (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S212000, C204S215000, C204S222000, C204S275100

Reexamination Certificate

active

07090750

ABSTRACT:
An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.

REFERENCES:
patent: 3798056 (1974-03-01), Okinaka et al.
patent: 3915832 (1975-10-01), Rackus et al.
patent: 4855020 (1989-08-01), Sirbola
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5788820 (1998-08-01), Liu
patent: 5893966 (1999-04-01), Akram et al.
patent: 6033548 (2000-03-01), Akram et al.
patent: 6083376 (2000-07-01), Akram et al.
patent: 6132570 (2000-10-01), Akram et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6277262 (2001-08-01), Akram et al.

Affiliated with

Also associated with

Rating

Plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3687201