Mounted circuit substrate and method for fabricating the...

Details Mounted circuit substrate and method for fabricating the... Mounted circuit substrate and method for fabricating the...

2006-02-28

2006-02-28

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S689000

Reexamination Certificate

active

07005318

ABSTRACT:
A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.

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