Chemical mechanical polishing apparatus

Details Chemical mechanical polishing apparatus Chemical mechanical polishing apparatus

2006-10-17

2006-10-17

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Machine

Rotary tool

C451S495000, C451S504000

Reexamination Certificate

active

07121933

ABSTRACT:
Disclosed is a chemical mechanical polishing apparatus for polishing a surface of a wafer using a mechanical friction as well as a chemical polishing agent. The chemical mechanical polishing apparatus includes a polishing head for absorbing a wafer and a polishing means for polishing the wafer. The polishing apparatus may include a platen composed of at least three segments formed in conformity with polishing zones, a polishing pad provided on each of the segments, and a support for supporting the segments such that the segments are separately adjustable in the height depending on the polishing zones and are rotatable.

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patent: 2005/0272348 (2005-12-01), Min et al.
patent: 2006/0094341 (2006-05-01), Schneider et al.

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