Poly (vinyl chloride) polyamide multi-layer structures

Details Poly (vinyl chloride) polyamide multi-layer structures Poly (vinyl chloride) polyamide multi-layer structures

1988-04-04

1989-09-19

Lesmes, George F.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

428355, 4284758, 4284769, 428518, B32B 2708, B32B 2734, C09J 702

Patent

active

048680540

ABSTRACT:
The present invention provides a multi-layer structure having improved adhesion between its layers. The multi-layer structure has in the following order: a layer of PVC, a layer of adhesive resin, and a layer of polyamide. The adhesive resin comprises organic solvent, vinyl resin, phthalate plasticizer, and leveling agent. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymer (VAGH), vinyl chloride-vinyl acetate copolymer (VYHH), and vinyl chloride-vinyl acetate-maleic acid terpolymer (VMCM). Electrical conductors formed from a wire conductor and the multi-layer structure have superior adhesion between layers even after the polyamide layer absorbs moisture.

REFERENCES:
patent: 3576940 (1971-05-01), Stone et al.
patent: 4171404 (1979-10-01), Carroll
patent: 4292463 (1981-09-01), Bow et al.
patent: 4327248 (1982-04-01), Campbell
patent: 4348496 (1982-09-01), Puhe et al.
patent: 4510348 (1985-04-01), Arrovo et al.
patent: 4626619 (1986-12-01), Uematsu

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