Semiconductor leadframes plated with thick nickel, minimum...

Details Semiconductor leadframes plated with thick nickel, minimum... Semiconductor leadframes plated with thick nickel, minimum...

2006-06-20

2006-06-20

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000

Reexamination Certificate

active

07064008

ABSTRACT:
A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering the base metal; a plated layer of pure tin on the nickel layer, selectively covering areas of the leadframe intended for attachment to other parts; and a plated layer of palladium on said nickel layer, selectively covering areas of said Leadframe intended for bonding wire attachment.

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Suzuki et al. (English Language Abstract), Sep. 12, 1984, pp. 1-2.
Zarlink Semiconductor, Zarlink Pb-Free/RoHS Strategy, pp. 1-2.
“Semiconductor Leadframes Comprising Silver Plating” Tellkamp, U.S. Patent Publication No. US 2002/0047186 A1 Published Apr. 25, 2002, filed Jul. 17, 2001.

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