Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-11-21
2006-11-21
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S740000, C029S721000, C029S742000, C029S743000, C029S739000
Reexamination Certificate
active
07137195
ABSTRACT:
Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.
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Haji Hiroshi
Hidese Wataru
Matsushita Electric - Industrial Co., Ltd.
Nguyen Tai Van
Pearne & Gordon LLP
Tugbang A. Dexter
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