Method for mounting electronic parts onto a board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S740000, C029S721000, C029S742000, C029S743000, C029S739000

Reexamination Certificate

active

07137195

ABSTRACT:
Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

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patent: 5876556 (1999-03-01), Takanami
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patent: 6691405 (2004-02-01), Kagei
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patent: 9-260464 (1997-10-01), None
patent: 11-163001 (1999-06-01), None
patent: 2000-315697 (2000-11-01), None

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