Method of fabricating a cover plate bonded over an...

Details Method of fabricating a cover plate bonded over an... Method of fabricating a cover plate bonded over an...

2006-11-14

2006-11-14

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S110000, C438S118000, C257S082000, C257S088000, C257S099000, C257S432000, C257S433000

Reexamination Certificate

active

07135352

ABSTRACT:
A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.

REFERENCES:
patent: 5920080 (1999-07-01), Jones
patent: 6268695 (2001-07-01), Affinito
patent: 6835950 (2004-12-01), Brown et al.
patent: 6867539 (2005-03-01), McCormick et al.
patent: 6897474 (2005-05-01), Brown et al.
patent: 2003/0143423 (2003-07-01), McCormick et al.
patent: 2003/0205317 (2003-11-01), Ha
patent: 2005/0045900 (2005-03-01), Silvernail
patent: 1361556 (2003-11-01), None
patent: 1 361 556 (2003-12-01), None
patent: WO0026973 (2000-05-01), None
patent: WO0205361 (2002-01-01), None
Craig Adhesives and Coatings Company, UV Pressure Sensitive Adhesives,□□http://www.craigahesives.com/UV/Laminating.htm; and Products,□□http://www/craogadhesives.com/products.htm.
Silvernail, J. et al., “Packaging OLED Displays Using Dual Stage Pressure Sensitive Adhesives”, 15 page Pwer Point Presentation, presented on Oct. 11, 2002.

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