Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-06-06
2006-06-06
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S782000, C257S786000, C361S748000, C361S808000
Reexamination Certificate
active
07057291
ABSTRACT:
A method for assembling vertically mountable semiconductor devices includes positioning the semiconductor devices so that backsides thereof face one another and that edges of the vertically mountable semiconductor devices along which contacts are disposed are in alignment with each other. The backsides of the vertically mountable semiconductor devices are secured to one another with an adhesive. Individual devices, such as dice, may be positioned and secured to one another in this manner, or larger, multiple-device-carrying substrates, such as device-bearing wafers, may be positioned back-to-back and secured to one another. If the assembled semiconductor devices are carried by larger substrates, individual modules may be subsequently separated from each other.
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Micro)n Technology, Inc.
TraskBritt PC
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