High-frequency circuit block, its manufacturing method,...

Details High-frequency circuit block, its manufacturing method,... High-frequency circuit block, its manufacturing method,...

2006-06-06

2006-06-06

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S723000, C257S758000

Reexamination Certificate

active

07057279

ABSTRACT:
A high frequency module device having a high frequency circuit block unit including a passive device. A plural number of unit wiring layers, each formed by an insulating layer, having a passive device unit in its portion, and by a pattern wiring, are layered on a dummy substrate, and are released from the dummy substrate to form the high frequency circuit block unit (2), which is mounted on a motherboard (3). The major surfaces of the respective unit wiring layers are planarized. The passive device unit and the pattern wiring, formed on the major surface of each unit wiring layer in the high frequency circuit block unit (2), can be formed with high accuracy to improve high frequency characteristics. The high frequency circuit block unit (2) is not in need of a base substrate, thus achieves reduction in size and cost.

REFERENCES:
patent: 5231751 (1993-08-01), Sorce
patent: 5674784 (1997-10-01), Jang et al.
patent: 6583364 (2003-06-01), Kurita et al.
patent: 2001/0015327 (2001-08-01), Kitamura et al.
patent: 540451 (1991-10-01), None
patent: 2000-36238 (2001-02-01), None
patent: 2001-144218 (2001-05-01), None
patent: 2001-298274 (2001-10-01), None

Affiliated with

Also associated with

Rating

High-frequency circuit block, its manufacturing method,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-frequency circuit block, its manufacturing method,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-frequency circuit block, its manufacturing method,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3677857