Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-02-28
2006-02-28
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S745000
Reexamination Certificate
active
07005388
ABSTRACT:
A semiconductor die is formed in a process that forms a hole through the wafer prior to the formation of the contacts and the metal-1 layer of an interconnect structure. The through-the-wafer hole is formed by using a wafer with a <110> crystallographic orientation and a wet etch, such as with ethanol (KOH) or tetramethylammonium hydroxide (TMAH).
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Drury Robert
Hopper Peter J.
Johnson Peter
Vashchenko Vladislav
National Semiconductor Corporation
Nhu David
Pickering Mark C..
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