Detachable on package voltage regulation module

Details Detachable on package voltage regulation module Detachable on package voltage regulation module

2006-08-15

2006-08-15

Nguyen, Tuan H. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C361S688000

Reexamination Certificate

active

07091586

ABSTRACT:
An integrated circuit (IC) package that includes an on-package voltage regulation module (VRM). An IC die is flip-bounded to a substrate having a plurality of connections to couple to a socket or to be mounted directly to a circuit board. An integrated heat spreader (IHS) is thermally coupled to the IC die and coupled (both electrically and mechanically) to the substrate. A VRM is coupled to the IHS. The IHS, which serves as an interconnect member, includes interconnect provisions for electrically coupling the VRM to the substrate. In one embodiment, the body of the IHS serves as a ground plane, while a separate interconnect layer includes electrical traces for routing electrical signals between the VRM and substrate. The VRM may comprise a detachable package that is coupled to the IHS via one of several means including fasteners, edge connectors and a parallel coupler.

REFERENCES:
patent: 5734555 (1998-03-01), McMahon
patent: 5982635 (1999-11-01), Menzies et al.
patent: 6469908 (2002-10-01), Patel et al.
patent: 2002/0145839 (2002-10-01), Smith et al.
patent: WO 01/65344 (2001-09-01), None
patent: PCT/US2004/035997 (2005-05-01), None

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