Methods for forming capacitor structures

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C257SE21214

Reexamination Certificate

active

07115515

ABSTRACT:
The invention includes methods of forming capacitor structures and removing organic material. An organic material, such as a photoresist, is disposed on a substrate. The organic material is contacted with a chemical mechanical polishing pad and a polishing fluid to remove the organic material from the substrate. The polishing fluid can be essentially free of particles, and can be water.

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patent: 6416685 (2002-07-01), Zhang et al.
patent: 6431953 (2002-08-01), Carter et al.
patent: 6468858 (2002-10-01), Lou
patent: 6706632 (2004-03-01), Sinha

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