Power semiconductor module

Details Power semiconductor module Power semiconductor module

1987-02-12

1988-11-29

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52PE, 174525, 357 72, 357 81, 361395, 361399, H05K 720

Patent

active

047886269

ABSTRACT:
A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom. Metallizations are disposed on the upper and lower surfaces of the ceramic plate. The metallization on the upper surface of the ceramic plate faces the interior of the housing and is structured to form conductor paths. Power semiconductor components, connecting elements and terminal elements for external termimals all are disposed on the upper surface of the ceramic plate. A frame is connected to the substrate in the interior of the housing for sealing against moisture.

REFERENCES:
patent: 4639759 (1987-01-01), Neidig et al.
Cain et al, "Circuit Module with Removable Cap"IBM Technical Disclosure Bulletin, vol. 19, No. 5, 10/76, p. 1803.

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