Memory package

Details Memory package Memory package

2006-06-20

2006-06-20

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S109000, C438S110000, C257S678000, C257S723000, C257S724000

Reexamination Certificate

active

07064003

ABSTRACT:
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.

REFERENCES:
patent: 5070032 (1991-12-01), Yuan et al.
patent: 5095344 (1992-03-01), Harari
patent: 5168465 (1992-12-01), Harari
patent: 5198380 (1993-03-01), Harai
patent: 5268318 (1993-12-01), Harari
patent: 5268319 (1993-12-01), Harari
patent: 5313421 (1994-05-01), Guterman et al.
patent: 5343063 (1994-08-01), Yuan et al.
patent: 5380672 (1995-01-01), Yuan et al.
patent: 5512505 (1996-04-01), Yuan et al.
patent: 5534456 (1996-07-01), Yuan et al.
patent: 5554553 (1996-09-01), Harari
patent: 5579259 (1996-11-01), Samachisa et al.
patent: 5595924 (1997-01-01), Yuan et al.
patent: 5654217 (1997-08-01), Yuan et al.
patent: 5661053 (1997-08-01), Yuan
patent: 5663901 (1997-09-01), Wallace et al.
patent: 5677872 (1997-10-01), Samachisa et al.
patent: 5703395 (1997-12-01), Berney
patent: 5712179 (1998-01-01), Yuan
patent: 5747359 (1998-05-01), Yuan et al.
patent: 5756385 (1998-05-01), Yuan et al.
patent: 5786988 (1998-07-01), Harari
patent: 5790384 (1998-08-01), Ahmad et al.
patent: 5847425 (1998-12-01), Yuan et al.
patent: 5867429 (1999-02-01), Chen et al.
patent: 5883409 (1999-03-01), Guterman et al.
patent: 5965913 (1999-10-01), Yuan et al.
patent: 6028336 (2000-02-01), Yuan
patent: 6040622 (2000-03-01), Wallace
patent: 6046935 (2000-04-01), Takeuchi et al.
patent: 6081447 (2000-06-01), Lofgren et al.
patent: 6103573 (2000-08-01), Harari et al.
patent: 6151248 (2000-11-01), Harari et al.
patent: 6168973 (2001-01-01), Hubbard
patent: 6208545 (2001-03-01), Leedy
patent: 6222265 (2001-04-01), Akram et al.
patent: 6426893 (2002-07-01), Conley et al.
patent: 6512263 (2003-01-01), Yuan et al.
patent: 6514794 (2003-02-01), Haba et al.
patent: 6582991 (2003-06-01), Maeda et al.
patent: 6599764 (2003-07-01), Ang et al.
patent: 6639309 (2003-10-01), Wallace
patent: 6797538 (2004-09-01), Wallace
patent: 2002/0127775 (2002-09-01), Ahmad et al.
patent: 2003/0183934 (2003-10-01), Barrett
patent: 2004/0000708 (2004-01-01), Rapport et al.
patent: 2004/0036157 (2004-02-01), Akram et al.
patent: 2004/0104469 (2004-06-01), Yagi et al.

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