Method of testing FPC bonding yield and FPC having testing...

Details Method of testing FPC bonding yield and FPC having testing... Method of testing FPC bonding yield and FPC having testing...

2006-06-13

2006-06-13

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

C438S017000, C438S018000, C324S763010, C324S765010, C324S701000

Reexamination Certificate

active

07060513

ABSTRACT:
A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.

REFERENCES:
patent: 6332669 (2001-12-01), Kato et al.
patent: 6448634 (2002-09-01), Hashimoto
patent: 6777973 (2004-08-01), Morishita
patent: 6798232 (2004-09-01), Lim
patent: 6930744 (2005-08-01), Ukita
patent: 6982569 (2006-01-01), Lee et al.
patent: 2002/0039802 (2002-04-01), Ban et al.
patent: 2002/0105263 (2002-08-01), Kim

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