Method of producing a radio frequency transponder with a molded

Details Method of producing a radio frequency transponder with a molded Method of producing a radio frequency transponder with a molded

1993-06-11

1995-05-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 174 524, 29827, 361728, H05K 102

Patent

active

054207576

ABSTRACT:
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead type substrate frame, the components are encapsulated in a plastic housing in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads, and then severing the leads at the periphery of the housing to provide a leadless package. The frame may be formed of a conductive material, an insulating material or as a printed circuit board. A novel printed circuit type lead frame whereby a coil of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed.

REFERENCES:
patent: 3627901 (1971-12-01), Happ
patent: 4028722 (1977-06-01), Helda
patent: 4289922 (1981-09-01), Devlin
patent: 4628148 (1986-12-01), Endou
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 5025114 (1991-06-01), Braden
patent: 5266739 (1993-11-01), Yamauchi
patent: 5283717 (1994-02-01), Hundt

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