Structure for cooling an integrated circuit

Details Structure for cooling an integrated circuit Structure for cooling an integrated circuit

1993-11-09

1995-05-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 257713, 361699, 361705, H05K 720

Patent

active

054207533

ABSTRACT:
In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and inclination of the IC. As a result, the heat conductor and IC are brought into close contact with each other. A compound intervenes between the heat conductor and the IC to enhance the close contact of the heat conductor and IC.

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patent: 5155660 (1992-10-01), Yamada
patent: 5227663 (1993-07-01), Patil
patent: 5298791 (1994-03-01), Liberty

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