Intermediate substrate

Details Intermediate substrate Intermediate substrate

2006-02-21

2006-02-21

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S260000, C361S306100, C361S782000

Reexamination Certificate

active

07002075

ABSTRACT:
An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.

REFERENCES:
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Kazuaki et al;.“Development of Low Inductance Thin Film Decoupling Capacitor;” Electronic Packaging Technology; vol. 19, No. 1; 2003.

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