GPT system for encapsulating an integrated circuit package

Details GPT system for encapsulating an integrated circuit package GPT system for encapsulating an integrated circuit package

1993-08-18

1995-05-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29855, 174 522, 257675, 257718, 26427217, 361723, 437219, H05K 720

Patent

active

054207525

ABSTRACT:
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are nonfunctional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

REFERENCES:
patent: 3622419 (1971-11-01), London
patent: 3706840 (1972-12-01), Moyle
patent: 3930114 (1975-12-01), Hodge
patent: 4701999 (1987-10-01), Palmer
patent: 4902606 (1990-02-01), Patraw
patent: 5091341 (1992-02-01), Asada
patent: 5252783 (1993-10-01), Baird

Affiliated with

Also associated with

Rating

GPT system for encapsulating an integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with GPT system for encapsulating an integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and GPT system for encapsulating an integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-367081