Semiconductor device and method of producing semiconductor devic

Details Semiconductor device and method of producing semiconductor devic Semiconductor device and method of producing semiconductor devic

1987-07-24

1988-11-29

LaRoche, Eugene R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 74, 174 52PE, H01L 2328, H01L 2302, H01L 2312, H02G 1308

Patent

active

047885831

ABSTRACT:
A semiconductor device has such a construction that free tip ends of stage bars extending from a stage do not extend to side surfaces of a resin package, and the resin package is constituted by an inner resin package portion and an outer resin package portion. The free tip ends of the stage bars are located inside the outer resin package portion and are completely sealed. A method of producing the semiconductor device includes steps of providing wires for electrically connecting terminals of a semiconductor element which is mounted on the stage with corresponding leads and forming the inner resin package portion over the semiconductor element and its vicinity including portions of the leads and stage bars which are connected to the stage. Then the free tip ends of the stage bars are cut and the outer resin package portion is formed over the inner resin package portion and the remaining portion of the semiconductor device, so that the cut free tip ends of the stage bars are completely sealed inside the outer resin package portion.

REFERENCES:
patent: 3778685 (1973-12-01), Kennedy
patent: 3902148 (1975-08-01), Drees et al.
patent: 4250347 (1981-02-01), Fierkens
Patent Abstracts of Japan, vol. 9, No. 173, Jul. 18, 1985 & JP-A-60 46 058.
Patent Abstracts of Japan, vol. 10, No. 32, Feb. 7, 1986 & JP-A-60 189 940.
Patent Abstracts of Japan, vol. 6, No. 264, Dec. 23, 1982 & JP-A-57 159 032.
Patent Abstracts of Japan, vol. 6, No. 185, Sept. 21, 1982 & JP-A-57 100 752.

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