Structure of image sensor module and a method for...

Details Structure of image sensor module and a method for... Structure of image sensor module and a method for...

2006-06-13

2006-06-13

Smith, Bradley K. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S749000, C257S680000, C257S428000

Reexamination Certificate

active

07061106

ABSTRACT:
The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.

REFERENCES:
patent: 4055761 (1977-10-01), Shimomura
patent: 6414299 (2002-07-01), Churei
patent: 6483030 (2002-11-01), Glenn et al.
patent: 2003/0057359 (2003-03-01), Webster
patent: 2005/0184219 (2005-08-01), Kirby
patent: 2005/0236684 (2005-10-01), Chen et al.

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