Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-10-10
2006-10-10
Rodriguez, Paul (Department: 2123)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C703S006000, C438S005000, C438S007000, C356S508000, C356S509000
Reexamination Certificate
active
07120514
ABSTRACT:
The present invention provides for a method and an apparatus for performing field-to-field compensation during semiconductor manufacturing. At least one semiconductor device is processed. Metrology data is collected from the processed semiconductor device. A field-to-field metrology analysis is performed based upon the metrology data. Residual-error analysis is performed based upon the field-to-field analysis.
REFERENCES:
patent: 4397543 (1983-08-01), Kolbe et al.
patent: 5243195 (1993-09-01), Nishi
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5444538 (1995-08-01), Pellegrini
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 5989761 (1999-11-01), Kawakubo et al.
patent: 6163366 (2000-12-01), Okamoto et al.
patent: 6372395 (2002-04-01), Kawakubo et al.
patent: 6445206 (2002-09-01), Montull et al.
patent: 6456736 (2002-09-01), Su et al.
patent: 6528219 (2003-03-01), Conrad et al.
patent: 6587744 (2003-07-01), Stoddard et al.
patent: 6594002 (2003-07-01), Drohan et al.
patent: 6699627 (2004-03-01), Smith et al.
Pete Klimecky, Craig Garvin, Cecilia G. Galarza, Brook S. Stutzman, Pramod P. Khargonekar and Fred L. Terry, Jr., “Real-Time Reactive Ion Etch Metrology Techniques to Enable In Situ response Surface Process Characterization” Sep. 4, 2000, 7 pages.
Terrence E. Zavecz, Rene Blanquies, “Predictive process control for sub-0.2 um lithography” SPIE, Mar. 2000, pp. 1-12.
Bode Christopher A.
Hewett Joyce S. Oey
Advanced Micro Devices , Inc.
Craig Dwin M.
Rodriguez Paul
Williams Morgan & Amerson P.C.
LandOfFree
Method and apparatus for performing field-to-field compensation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for performing field-to-field compensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for performing field-to-field compensation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3666252