Flip-chip attach structure and method

Details Flip-chip attach structure and method Flip-chip attach structure and method

2006-08-29

2006-08-29

Owens, Dougalas W. (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07098076

ABSTRACT:
A flip-chip attach method includes the steps of: attaching a chip on a transparent substrate such that each connecting pad of the chip is aligned with each electrical connection pad on the transparent substrate; and irradiating each connecting pad and each electrical connection pad from a side of the transparent substrate with a laser beam so as to weld the connecting pad to the electrical connection pad. Furthermore, the invention also provides a flip-chip attach structure including a transparent substrate and at least one chip. A surface of the transparent substrate is formed with a plurality of electrical connection pads, and the chip has a plurality of connecting pads. The connecting pads and the electrical connection pads are irradiated with a laser beam and are welded to each other. Thus, the chip is mounted to the transparent substrate.

REFERENCES:
patent: 5821627 (1998-10-01), Mori et al.
patent: 5834843 (1998-11-01), Mori et al.
patent: 6166556 (2000-12-01), Wang et al.
patent: 6184577 (2001-02-01), Takemura et al.
Houldcroft, Peter Thomas, 1977, Press Syndicate of the University of Cambridge, Welding Process Technology, p. 215.

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