Electronic assembly/system with reduced cost, mass, and...

Details Electronic assembly/system with reduced cost, mass, and... Electronic assembly/system with reduced cost, mass, and...

2006-12-05

2006-12-05

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S028000, C438S029000, C438S034000, C438S122000, C257SE51019, C257SE51021, C257SE51022, C257SE33056, C257SE33058, C257SE33062, C257SE33066, C257SE33067, C257SE33068, C257SE33070, C257SE33075

Reexamination Certificate

active

07144748

ABSTRACT:
An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during diode operation, and the array configured for passing coolant fluid for transfer of heat to the fluid. LED packages adjustable relative to a mounting grid, are also provided.

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