Integrated circuit chip

Details Integrated circuit chip Integrated circuit chip

2006-11-21

2006-11-21

Pham, Thanhha S. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257S629000

Reexamination Certificate

active

07138702

ABSTRACT:
An integrated circuit chip is provided. The chip includes a silicon substrate, a circuit, a seal ring, a ground ring and a guard ring. The circuit is formed on the silicon substrate and has an input/output (I/O) pad. The seal ring is formed on the silicon substrate and surrounds the circuit and the I/O pad. The ground ring is formed between the silicon substrate and the I/O pad, and the ground ring is electrically connected with the seal ring. The guard ring is formed above the silicon substrate and surrounds the I/O pad, and the guard ring is electrically connected with the seal ring.

REFERENCES:
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6376899 (2002-04-01), Seshan et al.
patent: 6566736 (2003-05-01), Ogawa et al.
patent: 6815821 (2004-11-01), Yu

Affiliated with

Also associated with

Rating

Integrated circuit chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3664103