Low profile package having multiple die

Details Low profile package having multiple die Low profile package having multiple die

2006-08-22

2006-08-22

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S674000, C257SE23043

Reexamination Certificate

active

07095099

ABSTRACT:
A low profile semiconductor device package includes a lead frame with terminal leads and two die pads for receiving at least two semiconductor die that are interconnected to form a circuit. A further low profile semiconductor device package includes a lead frame with two die pads for receiving at least two semiconductor die that are interconnected to form a circuit and also has a reduced height through removal of a mounting tab. An example of such device packages is a package that includes first and second MOSFET die, each connected to a respective die pad. The source of one MOSFET is connected to the drain of the other MOSFET, thereby forming a low profile device package that provides a half-bridge circuit. Other example device packages include different arrangements of two interconnected MOSFET die, two interconnected IGBTs, or a combination of a MOSFET die and a diode.

REFERENCES:
patent: 6144093 (2000-11-01), Davis et al.
patent: 6184585 (2001-02-01), Martinez et al.
patent: 2003/0057530 (2003-03-01), Karrer
patent: 2004/0004272 (2004-01-01), Luo et al.
patent: 2005/0224945 (2005-10-01), Saito et al.

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