Probe tile for probing semiconductor wafer

Details Probe tile for probing semiconductor wafer Probe tile for probing semiconductor wafer

2006-12-12

2006-12-12

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010, C324S762010

Reexamination Certificate

active

07148710

ABSTRACT:
A tile used to hold one or more probes for testing a semiconductor wafer. The tile has one or more sites for inserting one or more probes to test the semiconductor wafer. Each site has one or more holes. Each hole is coupled with a slot forming an angle. A probe is inserted into the file from a top of the tile through the hole and seated on the slot. The probe has a probe tip. The probe fip is in contact with the semiconductor wafer at one end of the slot at a bottom of the file. The probe fip is aligned with an X and Y coordinates of a bond pad on the semiconductor wafer.

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