Printed circuit board with improved cooling of electrical...

Details Printed circuit board with improved cooling of electrical... Printed circuit board with improved cooling of electrical...

2006-12-19

2006-12-19

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S252000, C361S719000

Reexamination Certificate

active

07151229

ABSTRACT:
The present invention relates to improved cooling of an electronic component loaded to a Printed Circuit Board, wherein the PCB comprises at its upper side at least one electronic component, and at least one Heat Conducting Member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the lower side of the PCB and has a thermal contact to the component.

REFERENCES:
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patent: 6000125 (1999-12-01), Kang
patent: 6219243 (2001-04-01), Ma et al.
patent: 6411516 (2002-06-01), Palumbo et al.
patent: 42 20 966 (1994-01-01), None
patent: 199 16 010 (2000-04-01), None
patent: 0 907 307 (1999-04-01), None
patent: WO 01/01738 (2001-01-01), None
patent: WO 02/054477 (2002-07-01), None

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