Method for flat electrodes

Details Method for flat electrodes Method for flat electrodes

2006-02-28

2006-02-28

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Reexamination Certificate

active

07005381

ABSTRACT:
The present invention is a method for reducing nanoscale surface roughness. The method involves exposing the surface to an environment that preferentially promotes evaporation of material from the region of nanoscale roughness. The methods involve either heating the surface, or flushing an inert gas across the surface, or a combination of both.

REFERENCES:
patent: 6204151 (2001-03-01), Malik et al.
patent: 6417060 (2002-07-01), Tavkhelidze et al.
patent: 2003/0035261 (2003-02-01), Bensaoula et al.

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