Mold assembly for a package stack via bottom-leaded plastic...

Details Mold assembly for a package stack via bottom-leaded plastic... Mold assembly for a package stack via bottom-leaded plastic...

2006-08-22

2006-08-22

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

C425S470000

Reexamination Certificate

active

07094046

ABSTRACT:
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

REFERENCES:
patent: 3404454 (1968-10-01), Sayles
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4778641 (1988-10-01), Chia
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5172214 (1992-12-01), Casto
patent: 5200364 (1993-04-01), Loh
patent: 5214845 (1993-06-01), King et al.
patent: 5331235 (1994-07-01), Chun
patent: 5418189 (1995-05-01), Heinen
patent: 5436500 (1995-07-01), Park et al.
patent: 5466887 (1995-11-01), Hasegawa
patent: 5471369 (1995-11-01), Honda et al.
patent: 5475259 (1995-12-01), Kasai et al.
patent: 5483024 (1996-01-01), Russell et al.
patent: 5486720 (1996-01-01), Kierse
patent: 5493153 (1996-02-01), Arikawa et al.
patent: 5498902 (1996-03-01), Hara
patent: 5508565 (1996-04-01), Hatakeyama et al.
patent: 5519251 (1996-05-01), Sato et al.
patent: 5527743 (1996-06-01), Variot
patent: 5530286 (1996-06-01), Murakami et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5535509 (1996-07-01), Tomita et al.
patent: 5554823 (1996-09-01), Hasegawa
patent: 5554886 (1996-09-01), Song
patent: 5570272 (1996-10-01), Variot
patent: 5572068 (1996-11-01), Chun
patent: 5679978 (1997-10-01), Kawahara et al.
patent: 5760471 (1998-06-01), Fujisawa et al.
patent: 5763939 (1998-06-01), Yamashita
patent: 5783134 (1998-07-01), Yabe et al.
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5986209 (1999-11-01), Tandy
patent: 6007317 (1999-12-01), Mess
patent: 6146919 (2000-11-01), Tandy
patent: 6166328 (2000-12-01), Tandy
patent: 6188021 (2001-02-01), Tandy
patent: 6213747 (2001-04-01), Tandy
patent: 6265660 (2001-07-01), Tandy
patent: 61-269338 (1986-11-01), None
patent: 63-15431 (1988-01-01), None
patent: 8-8389 (1996-01-01), None
Samsung DRAM Web Page, High Density DRAMs, 2 pages, no date.

Affiliated with

Also associated with

Rating

Mold assembly for a package stack via bottom-leaded plastic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold assembly for a package stack via bottom-leaded plastic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold assembly for a package stack via bottom-leaded plastic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3659767