Semiconductor device with pins and method of assembling the...

Details Semiconductor device with pins and method of assembling the... Semiconductor device with pins and method of assembling the...

2006-12-05

2006-12-05

Malsawma, Lex H. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C361S709000

Reexamination Certificate

active

07144762

ABSTRACT:
A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged portion at one end thereof and an engaging portion at the other end thereof. An engaging member is provided to engage with the engaging portions of the pins that pass though the holes in the heat sink and the holes in the substrate and protrude from the substrate. Springs are arranged between the enlarged portions of the pins and the heat sink. In assembling the semiconductor device, the pins are held collectively by a holding member, and after the semiconductor device is assembled, the holding member is removed from the pins.

REFERENCES:
patent: 5384940 (1995-01-01), Soule et al.
patent: 5761041 (1998-06-01), Hassanzadeh et al.
patent: 5870286 (1999-02-01), Butterbaugh et al.
patent: 5978223 (1999-11-01), Hamilton et al.
patent: 6307747 (2001-10-01), Farnsworth et al.
patent: 2003/0159819 (2003-08-01), Lee
patent: 2005/0072558 (2005-04-01), Whitney et al.
patent: 30-64402 (1999-09-01), None
Partial Translation of Japanese Registered Utility Model No. 30-64402.

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