Precious metal solder

Details Precious metal solder Precious metal solder

2006-12-26

2006-12-26

Wyszomierski, George (Department: 1742)

Metal treatment

Stock

Noble metal base

C420S507000, C420S511000

Reexamination Certificate

active

07153375

ABSTRACT:
Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300° C. to about 1500° C. for platinum, from about 1000° F. to about 1400° F. for silver, and from about 1100° F. to about 1550° F.

REFERENCES:
patent: 4165983 (1979-08-01), Bourne et al.
patent: 4591483 (1986-05-01), Nawaz
patent: 5221207 (1993-06-01), Schoeck et al.
patent: 6372060 (2002-04-01), Weinstein
patent: 6620378 (2003-09-01), Weinstein
patent: 6863746 (2005-03-01), Weinstein

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