Method and system for providing quality control on wafers...

Details Method and system for providing quality control on wafers... Method and system for providing quality control on wafers...

2006-08-08

2006-08-08

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

C702S081000, C324S765010

Reexamination Certificate

active

07089132

ABSTRACT:
A method for providing quality control on wafers running on a manufacturing line is disclosed. The resistances on a group of manufacturing test structures within a wafer running on a wafer manufacturing line are initially measured. Then, an actual distribution value is obtained based on the result of the measured resistances on the group of manufacturing test structures. The difference between the actual distribution value and a predetermined distribution value is recorded. Next, the resistances on a group of design test structures within the wafer are measured. The measured resistances of the group of design test structures are correlated to the measured resistances of the group of manufacturing test structures in order to obtain an offset value. The resistance of an adjustable resistor circuit within the wafer and subsequent wafers running on the wafer manufacturing line are adjusted according to the offset value.

REFERENCES:
patent: 2005/0017746 (2005-01-01), Matsumoto et al.

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