Interconnection lead with redundant bonding regions

Details Interconnection lead with redundant bonding regions Interconnection lead with redundant bonding regions

1988-05-02

1989-09-19

Abrams, Neil

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

29827, 357 70, H01R 909, H05K 334

Patent

active

048677159

ABSTRACT:
Redundant interconnection bonds are formed on an integrated circuit using an interconnection lead comprising a plurality of electrically conductive fingers separated from each other by an electrically nonconductive medium. The individual conductive fingers are attached to, and extend out from, an electrically conductive base at one end. In addition, the individual conductive fingers are connected to each other at a separate region. The improved interconnect lead is structurally durable and the resulting redundant bond exhibits improved electrical and operating characteristics. The interconnection lead is suitable for use with tape automated bonding or flexible circuitry technologies.

REFERENCES:
patent: 3834604 (1974-09-01), Fendley et al.
patent: 4034149 (1977-07-01), Zaleckas
patent: 4109096 (1978-08-01), Dehaine
patent: 4631820 (1986-12-01), Harada et al.

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